Polyetherimide (PEI): Structural Features, Main Properties, and Typical Application Directions

Overview

 

In high-temperature insulating parts, electronic device housings, dielectric films, medical device components, and high-performance additively manufactured components, material selection usually requires simultaneous consideration of heat resistance, dimensional stability, electrical insulation, flame retardancy, and processing methods. The reason polyetherimide has long been discussed as a separate subject is that it brings these requirements together within the same class of amorphous thermoplastic materials. Taking SABIC’s published data on the ULTEM resin family as an example, PEI materials can exhibit a glass transition temperature (glass transition temperature, Tg) of 217°C, a relative thermal index (relative thermal index, RTI) of up to 180°C, a limiting oxygen index (limiting oxygen index, LOI) of about 47, and can achieve UL 94 V-0 at a thin-wall thickness of 0.41 mm, while also offering good dimensional stability and thermoplastic processability.

 

In recent years, publicly available studies and reviews on PEI have focused more on specific issues such as high-temperature dielectric materials for capacitors, additive manufacturing, lithium battery separators, surface metallization of three-dimensional structural parts, as well as raw material sourcing and environmental burden. When SABIC commissioned its Singapore ULTEM resin plant in 2024, it also identified aerospace, medical, 5G, artificial intelligence, and electric vehicles as the high-technology end-use industries served by the facility, and proposed a target of increasing global ULTEM specialty resin capacity by more than 50%.

 

1. Structural Basis and Material Attributes of PEI

 

1.1 The Main-Chain Structure Determines the Combination of Heat Resistance and Processability

 

PEI is a polymer whose main chain contains both imide units and ether linkages, and it is usually classified as an important category of thermoplastic polyimides. A classic 1983 paper presented it as a new high-performance amorphous thermoplastic resin. This definition indicates that PEI retains the high thermal stability and high rigidity brought by the imide structure, while reducing the common problems of infusibility and poor flowability often seen in traditional aromatic polyimides through the introduction of ether bonds.

 

The backbone of commercially typical PEI can be traced to the polycondensation of the bisphenol A-type dianhydride 4,4′-(4,4′-isopropylidenediphenoxy)bisphthalic anhydride [BPADA] with m-phenylenediamine [m-PDA]. The imide ring increases main-chain rigidity, polarity, and thermal stability, the ether bond introduces a certain degree of flexibility into the main chain, and the aromatic backbone further supports modulus and dimensional stability. Therefore, PEI can still maintain good insulation, dimensional stability, and thermoplastic processing characteristics at relatively high temperatures.

 

1.2 Main Structural Features of PEI and Corresponding Properties

 

Structural or Material Attribute	Main Role	Corresponding Application Characteristics
Imide ring	Increases main-chain rigidity, polarity, and thermal stability	Helps maintain relatively high Tg, high-temperature rigidity, and long-term heat resistance
Ether bond	Introduces a certain degree of flexibility into the main chain	Retains melt-processing capability and alleviates excessive brittleness and poor flowability of the system
Aromatic backbone	Increases modulus, strength, and dimensional stability	Suitable for structural parts and insulating parts requiring relatively high dimensional precision
Amorphous thermoplastic	No obvious crystalline melting point; can undergo conventional thermoplastic processing	Facilitates injection molding, extrusion, thermoforming, blow molding, film processing, and some additive manufacturing

 

1.3 The Amorphous Thermoplastic Characteristic Determines the Processing Route

 

The “amorphous thermoplastic” nature of PEI is the prerequisite for its engineering use. SABIC’s published data clearly list processing routes such as extrusion, thermoforming, extrusion blow molding, and injection molding, and indicate that its flowability can support long flow lengths and thin-wall molding. Compared with semi-crystalline engineering plastics, PEI does not require crystallization behavior to be treated as the core of processing control, which is also an important reason why it can be used in dielectric films, thin-wall housings, and some complex structural parts.

 

2. Performance Characteristics and Conditions of Use of PEI

 

2.1 Typical Property Combination of PEI

 

Taking SABIC’s published data on ULTEM resins as an example, the relevant products have a glass transition temperature (glass transition temperature, Tg) of 217°C, a relative thermal index (relative thermal index, RTI) of up to 180°C, a limiting oxygen index (limiting oxygen index, LOI) of about 47, and can achieve UL 94 V-0 at a thin-wall thickness of 0.41 mm, while maintaining good dimensional stability and melt processability.

 

PEI has relatively high heat resistance, but its material characteristics are not limited to heat resistance. Compared with many materials that emphasize only temperature resistance, PEI also possesses electrical insulation, dimensional stability, flame retardancy, and thermoplastic processability, and is therefore often used in components where thermal, electrical, dimensional, and processing requirements coexist.

 

SABIC’s data show that PEI has good resistance to various automotive and aerospace fluids, aliphatic hydrocarbons, alcohols, acids, and weak aqueous solutions. This indicates that PEI has a certain degree of chemical resistance, but whether it is suitable for a specific application still needs to be judged in combination with the product type, processing method, and actual service conditions.

 

2.2 Common Property Combinations of PEI and Their Application Implications

 

Property Item	Typical Performance	Application Characteristics
Heat resistance	Tg about 217°C; RTI of some products can reach 180°C	Suitable for structural parts and insulating parts in environments exposed to heat for relatively long periods
Electrical insulation	Can be used for high-temperature insulating parts and dielectric films	Suitable for insulation and dielectric applications in electronics and electrical engineering
Dimensional stability	Maintains good dimensional stability at high temperatures	Suitable for precision housings and high-tolerance parts
Flame retardancy	Most products can achieve relatively high flame-retardant ratings without additional flame retardants	Suitable for applications with requirements for flame retardancy and low smoke
Thermoplastic processability	Can be injection molded, extruded, thermoformed, blow molded, and used in some additive manufacturing processes	Facilitates extension from resin to films, housings, and complex components
Chemical resistance	Has good resistance to various fluids, alcohols, acids, and weak aqueous solutions	Suitable for parts exposed to complex media, but verification against the specific medium is still required

 

2.3 Key Points for Judging PEI in Different Applications

 

PEI can be used in different areas such as electronics and electrical engineering, additive manufacturing, and medical devices, but the basis for judgment is not the same. The same material name does not mean that specific products can be directly substituted for one another. Once a specific application is involved, it is usually still necessary to verify the processing form, performance requirements, and conditions of use.

 

2.3.1｜Key Points for Judging PEI in Different Applications and Verification Items

 

Application Area	What Should First Be Distinguished	Key Verification Items	Relevant Products and Key Usage Information
Electronics / dielectric films	Whether it is a general insulating part, or a high-temperature dielectric film or capacitor dielectric	Operating temperature range, dielectric properties, dimensional stability, compatibility with film processing, resistance to reflow soldering	ULTEM UTF120: used for high-temperature professional-grade capacitor dielectric films; published data give a film service temperature range of -40°C to 150°C, and capacitor designs using this film can withstand 260°C reflow soldering
Additive manufacturing	Whether it is a sample, tooling, or an end-use component	Printing temperature, melt-flow characteristics, control of shrinkage and warpage, interlayer bonding, post-processing conditions, dimensional and performance stability of end-use parts	ULTEM 9085: used for polyetherimide-based fused deposition modeling; key verification points include dimensional stability, interlayer properties, flame-retardant requirements, and resistance to chemical media for end-use parts
Medical devices / pharmaceutical equipment	Whether it is a specific product with clearly stated medical support information	Biocompatibility data, sterilization methods, contact conditions with the human body or drugs, service life, and whether there are implantation or long-term contact restrictions	ULTEM HU1004: published data provide information on steam sterilization, gamma irradiation, and hydrogen peroxide vapor sterilization; SABIC medical information states that it does not support applications involving continuous in-body use for more than 29 days; whether it is suitable for a specific medical device still requires corresponding biocompatibility and regulatory evaluation according to the intended use

 

3. Several Key Research Directions of PEI in Recent Years

 

Research on PEI in recent years has no longer remained at the level of material definition, basic heat resistance, or a general listing of properties, but has instead concentrated on several specific issues: loss control in high-temperature capacitor dielectrics under high temperature and high electric field, component consistency in additive manufacturing, the synergy of heat resistance and wettability in lithium battery separators, surface metallization of three-dimensional structural parts, and feedstock sources and post-disposal treatment.

 

3.1 High-Temperature Dielectric Energy Storage

 

In the field of high-temperature dielectrics, the research focus has shifted from “whether the material is heat-resistant” to “whether the material can maintain low conduction loss, high charge-discharge efficiency, and high discharge energy density under high temperature and high electric field.” A 2023 study applied energy-level structure regulation to PEI dielectric materials to improve high-temperature energy-storage performance; a 2024 Materials Horizons paper further combined deep-trap design, covalent crosslinking, and interfacial regulation of functionalized boron nitride nanosheets, enabling the composite to maintain high discharge energy density and charge-discharge efficiency at both 150°C and 200°C, while increasing the glass transition temperature by 20.2°C. Therefore, the key point in evaluating high-temperature capacitor dielectrics cannot remain only at Tg, but must also consider leakage current, breakdown, efficiency, and discharge energy density.

 

3.2 Additive Manufacturing

 

In additive manufacturing, the research focus for PEI is not “whether it can be printed,” but whether the printed component can stably meet end-use requirements. ULTEM 9085 is already a relatively mature polyetherimide-based fused deposition modeling material, and publicly available data emphasize its high strength-to-weight ratio, high heat resistance, high resistance to chemical media, and flame, smoke, and toxicity-related performance. At the same time, recent studies and reviews repeatedly mention that high-performance polymers in fused filament fabrication still face issues such as shrinkage, warpage, interlayer bonding, and high processing temperatures. For PEI, what truly matters in this direction is print process control, interlayer performance, and end-use part consistency.

 

3.3 Lithium Battery Separators and Membrane Materials

 

In the field of membrane materials, PEI has already developed a relatively clear research line for lithium battery separators. A 2025 review discussed PEI membrane separators as a dedicated topic in high-performance lithium batteries, focusing on the synergy among heat resistance, wettability, ion transport, and mechanical integrity. The issue here is the need to simultaneously control thermal shrinkage, electrolyte wettability, ion transport, and membrane mechanical strength. PEI enters this direction mainly on the basis of its heat resistance and film-forming processability.

 

3.4 Surface Metallization of Three-Dimensional Structural Parts

 

PEI itself is an insulating material, but in electronic devices some complex three-dimensional structures also require conductive surfaces. A 2024 study showed that supercritical carbon dioxide-assisted electroless nickel-phosphorus plating can achieve metallization on three-dimensional PEI structures and obtain relatively low resistance suitable for use in electronic devices. What this direction focuses on is not the intrinsic conductivity of PEI itself, but the integration method between the insulating substrate and the conductive surface, and whether complex structural parts can simultaneously satisfy both forming and conductive interconnection functions.

 

3.5 Feedstock Sources, Environmental Burden, and Post-Disposal Degradation Research

 

Research related to feedstock sources, environmental burden, and post-disposal degradation is increasing. SABIC has already launched renewable bio-based ULTEM grades certified under the International Sustainability and Carbon Certification Plus (ISCC+); calculated according to the mass balance approach, 25.5 kg of fossil-based feedstock can be replaced with bio-based feedstock for every 100 kg of ULTEM resin produced. A 2026 life-cycle study showed that the environmental performance of high-performance thermoplastic materials is significantly affected by feedstock sources, processing methods, and reinforcement systems; a 2024 study on the thermo-oxidative degradation of polyimide engineering plastics also included PEI in its analysis. For PEI, feedstock sources, manufacturing process, environmental burden, and post-disposal degradation behavior need to be discussed together.

 

3.6 Research Directions of PEI in Recent Years and the Corresponding Issues

 

Research Direction	Main Focus	Core Issue	Common Research Approaches
High-temperature dielectric energy storage	PEI films and dielectric composites	Increased leakage current, reduced efficiency, and insufficient discharge energy under high temperature	Energy-level regulation, deep-trap design, crosslinking, and interfacial engineering
Additive manufacturing	FFF/FDM components and filaments	Shrinkage, warpage, interlayer bonding, and end-use part consistency	Parameter optimization, material modification, equipment temperature control, and post-processing
Lithium battery separators and membrane materials	PEI membranes and porous separators	Difficulty in balancing heat resistance, wettability, ion transport, and mechanical integrity	Pore-structure regulation, surface polarity regulation, and composite membrane design
Three-dimensional surface metallization	Three-dimensional PEI electronic structural parts	Integrated manufacturing of insulating substrates and conductive surfaces	Low-damage activation, uniform plating, and construction of low-resistance coatings
Feedstock sources and post-disposal treatment	Bio-based feedstocks, processing routes, and degradation behavior	Feedstock substitution, processing energy consumption, and degradation and treatment after disposal	Mass-balance bio-based feedstocks, life-cycle analysis, and degradation pathway research

 

4. Several Issues That Need to Be Distinguished When Using PEI

 

PEI refers to the class of polyetherimide materials, not to one fixed product. Publicly available data for specific commercial products can be used to illustrate the typical characteristics of a certain type of PEI, but they cannot be directly generalized into universal conclusions for all PEI. Once a specific application is involved, separate judgment is still required in combination with product type, processing conditions, and actual conditions of use.

 

4.1 Several Issues That Need to Be Distinguished When Using PEI

 

Issue That Needs to Be Distinguished	It Should Not Be Understood This Way Directly	What Else Needs to Be Considered
Public data for specific commercial products	The data of one specific product can represent all PEI	Product type, molecular weight or modification method, filler system, thickness, color, and processing conditions
High-temperature dielectric applications	A relatively high Tg means that high-temperature energy-storage performance is necessarily qualified	Leakage current, breakdown, charge-discharge efficiency, and discharge energy under high temperature and high electric field
Additive manufacturing applications	If the material can be printed, the end-use part must be usable	Printing temperature, interlayer bonding, shrinkage and warpage, post-processing, and end-use part consistency
Medical devices / pharmaceutical equipment applications	Having medical support information means it can be used for long-term implantation or long-term contact	Biocompatibility data, sterilization methods, contact conditions, service life, and whether there are implantation restrictions

 

When the application simultaneously requires relatively high heat resistance, dimensional stability, electrical insulation, inherent flame retardancy, and thermoplastic processability, PEI remains a highly representative material choice; when the problem further extends to high temperature and high electric field, repeated sterilization, end-use part printing, or post-disposal treatment, the focus of judgment should shift to the corresponding loss behavior, sterilization compatibility, process consistency, and degradation behavior.

 

5. Product Navigation Table for Products Related to Polyetherimide (PEI) Structural Design, Processing Routes, and High-Temperature Application Research (Choose Table 1 to Table 4 According to Research or Experimental Goals)

 

Research or Experimental Goal	Which Table to Read First	Why Read This Table First	Which Table(s) to Cross-Reference	Reason for Cross-Reference
Want to first clarify what the PEI resin itself, main-chain monomers, and end-capping regulators are	Table 1	Table 1 separates the resin itself, classic dianhydride/diamine monomers, comonomers, and end-capping components, making it suitable for first distinguishing between the two routes of “direct processing of the resin” and “starting from monomer polycondensation”	Table 2	After determining the resin or monomer source, Table 2 can then be used to connect polycondensation, dissolution, film casting, or high-temperature reactions to specific media
Already have dianhydrides and diamines in hand and want to carry out comparative experiments on PEI polycondensation, end-group regulation, or the effects of different monomer combinations on properties	Table 1	Table 1 directly corresponds to dianhydrides, diamines, and end-capping components, making it convenient to first determine whether the comparison concerns the main-chain framework, diamine configuration, or degree-of-polymerization control	Table 2, Table 3	Table 2 corresponds to the selection of polycondensation and casting media; Table 3 can further be used to compare the compatibility of monomer variations with dielectric or thermally conductive fillers
Want to screen PEI resin dissolution, solution casting, phase-inversion membrane formation, or spinning precursor solutions	Table 2	Table 2 focuses on commonly used media for casting, solution preparation, and high-temperature reactions, making it suitable for first comparing dissolving ability, volatility or devolatilization characteristics, and film-formation process control	Table 1, Table 4	Table 1 can be used to review whether the system involves direct resin processing or synthesis first followed by film formation; Table 4 can then be used after film formation to extend into separator, electrolyte membrane, or surface metallization directions
Want to carry out research on PEI high-temperature dielectric films, energy-storage dielectrics, or dielectric-constant regulation	Table 3	Table 3 first distinguishes high-dielectric fillers, interfacial-regulation fillers, and thermally conductive insulating fillers, making it easier to first determine whether the goal is to increase dielectric constant, suppress dielectric loss, or balance both dielectric and thermal-conduction performance	Table 1, Table 2	Table 1 can be used to review the matrix main chain and molecular-weight regulation components; Table 2 can be used to implement composite slurry dispersion, casting, and drying-medium selection
Want to prepare thermally conductive insulating PEI composites for electronic packaging, heat-dissipating insulating parts, or high-temperature electrical components	Table 3	Table 3 separates aluminum nitride, silicon nitride, hexagonal boron nitride, and alumina, making it suitable for first judging differences in thermal-conduction pathways, insulation retention, and filler morphology	Table 2, Table 1	Table 2 can be further used to handle dispersion and film-forming or molding media; Table 1 can be used to review the effects of matrix resin or monomer structure on high-filler loading and processability
Want to prepare PEI into structurally conductive parts and carry out sensitization, activation, and electroless nickel plating experiments	Table 4	Table 4 arranges sensitizers, activation precursors, nickel sources, and reducing agents according to the electroless plating sequence, making it suitable for first establishing the experimental chain for surface metallization	Table 1, Table 2	Table 1 can be used to review matrix source and molecular-weight control; Table 2 can be used for pretreatment, cleaning, coating, or film-forming media arrangement
Want to carry out high-temperature electrochemical research around PEI porous membranes, separators, or polymer electrolyte systems	Table 2	Table 2 first addresses casting solutions, phase inversion, and salt-containing solution preparation, making it a more suitable starting point for the membrane-formation stage	Table 4, Table 3	Table 4 can then be used for lithium-salt selection; Table 3 can further be used to introduce inorganic fillers to regulate thermal stability, mechanical retention, and interfacial behavior
Want to design a relatively complete PEI research program covering main-chain design, processing, composite modification, and functionalization directions simultaneously	Table 1	Table 1 is suitable as the starting point for first clarifying the hierarchy of the resin itself, monomer sources, and degree-of-polymerization regulation, so as to avoid mixing structural issues with processing issues	Table 2, Table 3, Table 4	Sequential cross-referencing is clearer: Table 2 addresses solution preparation and shaping, Table 3 addresses dielectric or thermally conductive fillers, and Table 4 then moves into surface metallization or electrochemical membrane directions

 

Table 1 | PEI Resin Itself, Main-Chain Monomers, and End-Capping Regulation Components

 

Category	CAS No.	Aladdin Catalog No.	Name	Specification or Purity	Product Features and Applications
PEI resin itself	61128-46-9	P1520542	Polyetherimide(PEI)	melt index: 9 g/10 min	PEI resin itself, which can be directly used in injection molding, extrusion, hot pressing, or solution film-formation research, and can also serve as the matrix resin for dielectric films, thermally conductive insulating composites, and high-temperature printing.
Classic PEI dianhydride monomer	38103-06-9	B1507222	(BPADA)	≥99.5%	A classic PEI dianhydride source. When paired with m-phenylenediamine, it can form a representative main-chain structure; used to compare the effects of dianhydride structure on glass-transition temperature, flowability, and film-forming properties.
Classic PEI diamine monomer	108-45-2	P111632	m-Phenylenediamine	≥99.5%	A classic PEI diamine source. Together with BPADA, it forms a representative polycondensation combination; used to balance heat resistance, amorphous characteristics, and processability.
Rigid para-diamine monomer	106-50-3	P108426	p-Phenylenediamine	sublimed grade, ≥99%	Has greater para-rigidity and can be used as a comonomer or control diamine to increase chain regularity and modulus, and to compare the effects of diamine configuration on dielectric, thermomechanical, and dissolution behavior.
Ether-bridged dianhydride comonomer	1823-59-2	O399341	4,4′-Oxydiphthalic anhydride(ODPA)	≥99%	An ether-bridged dianhydride that can be used as a PEI or polyimide comonomer dianhydride to regulate chain flexibility, solubility, and film toughness, and to compare the effects of different dianhydride structures on dielectric and thermal properties.
Ether-bridged diamine comonomer	101-80-4	D104463	4,4′-Diaminodiphenyl ether (4,4'-ODA)	≥98%	An aromatic diamine containing an ether bridge, which can be combined with ODPA and others to introduce more flexible chain segments; used to compare the effects of changes in main-chain flexibility on toughness, film-forming properties, and thermal performance.
Anhydride-type end-capping regulator	85-44-9	P116466	o-Phthalic anhydride	guaranteed reagent, ≥99%	A monofunctional anhydride-type end-capping component used to limit degree of polymerization, regulate end groups, and control melt flow or solution viscosity; commonly used in molecular-weight gradient experiments for polycondensation.
Amine-type end-capping regulator	62-53-3	A112119	Aniline	Standard for GC, ≥99.9%(GC)	A monoamine-type end-capping component used to limit chain growth and introduce changes in amine end groups, suitable for comparing the effects of molecular weight and end-group differences on molding, dielectric, and film properties.

 

Table 2 | Common Media for PEI Solution Preparation, Film Casting, and High-Temperature Polycondensation

 

Category	CAS No.	Aladdin Catalog No.	Name	Specification or Purity	Product Features and Applications
Polar amide-type processing solvent	127-19-5	D119664	N-N-Dimethylacetamide(DMAC)	anhydrous, ≥99.8%	A commonly used solution-processing medium for PEI, applicable to resin dissolution, casting-solution preparation, and composite-slurry formulation, and also suitable for comparing the effects of solvent-exchange rate on phase-inversion membrane morphology.
Polar amide-type processing solvent	68-12-2	D119450	N,N-Dimethylformamide（DMF）	anhydrous, ≥99.8%	Can be used for PEI casting solutions, spinning dopes, and composite-slurry preparation, and is often used to compare the effects of solvent evaporation and phase-separation processes on pore structure and surface quality.
Lactam-type high-boiling processing solvent	872-50-4	M119668	1-Methyl-2-pyrrolidinone（NMP）	anhydrous, ≥99.5%	A high-boiling, strongly dissolving medium suitable for high-solid-content PEI casting solutions, separators, and coating formulations, and also convenient for maintaining long-term uniform dispersion in composite systems.
Aromatic high-boiling reaction medium	95-50-1	D119675	1，2-Dichlorobenzene	anhydrous, ≥99%	A high-boiling reaction medium that can be used for high-temperature polycondensation of dianhydrides/diamines, chemical imidization, and devolatilization processes, and is suitable for main-chain construction experiments requiring higher reaction temperatures.
Polar sulfoxide-type blending and solution-preparation solvent	67-68-5	D103272	Dimethyl sulfoxide（DMSO）	AR, ≥99%(GC)	A strongly polar medium for blending and solution preparation, which can be used for PEI film casting, salt-containing system solution preparation, and polymer electrolyte precursor formulation, making it convenient to compare the effects of solvents on membrane morphology and ion-transport behavior.

 

Table 3 | PEI Dielectric Regulation, Thermally Conductive Insulation, and Composite Fillers

 

Category	CAS No.	Aladdin Catalog No.	Name	Specification or Purity	Product Features and Applications
Thermally conductive insulating nitride filler	24304-00-5	A432363	Aluminum nitride	nanopowder, ≤100 nm	A highly thermally conductive insulating filler used to construct thermally conductive pathways in PEI while maintaining electrical insulation, commonly used in heat-dissipating insulating parts, electronic packaging, and high-temperature electrical composites.
Insulating oxide filler	1344-28-1	A431928	Aluminum oxide	super dry grade	A general insulating oxide filler used to improve the dimensional stability, wear resistance, and insulation of PEI composites, and can also serve as a control filler for balancing thermal conductivity and cost.
High-dielectric ceramic filler	12047-27-7	B106131	Barium titanate	PrimorTrace™, ≥99.99% metals basis	A high-dielectric ceramic filler used to increase the dielectric constant of PEI composite systems, suitable for high-temperature energy-storage dielectrics, dielectric films, and polarization-response regulation research.
Interfacial- and defect-regulating dioxide filler	7631-86-9	S116482	Silicon dioxide	AR, ≥99%	Can be used to improve filler dispersion, reduce local electric-field concentration, and regulate the dielectric loss, dimensional stability, and mechanical retention of PEI composites.
High-dielectric oxide filler	13463-67-7	T105418	Titanium oxide	AR, ≥99%	A highly polarizable oxide filler that can be used to enhance polarization response and regulate dielectric behavior, suitable for control studies on PEI functional films, coatings, and dielectric composites.
Thermally conductive insulating nitride filler	12033-89-5	S431556	Silicon nitride	≥99.9% metals basis, Powder	Possesses both thermal-conduction and insulation characteristics, and can be used in PEI thermal-management composites to compare the effects of different nitride fillers on strength retention and heat conduction.
Thermally conductive insulating nitride filler	10043-11-5	B106033	Boron nitride	≥99.9% metals basis, 1～2um	A platelet thermally conductive insulating filler suitable for constructing in-plane or through-plane thermally conductive pathways in PEI while maintaining electrical insulation, commonly used in electronic heat dissipation and high-temperature insulating components.

 

Table 4 | Supporting Components for PEI Surface Metallization and Electrochemical Membrane Research

 

Category	CAS No.	Aladdin Catalog No.	Name	Specification or Purity	Product Features and Applications
Electroless nickel source	10101-97-0	N431238	Nickel(II) sulfate hexahydrate	suitable for analysis, ACS, premium grade	A Ni-P electroless nickel source used in plating-bath formulations for PEI surface metallization, providing the nickel source required for metallic-layer deposition.
Electroless plating activation precursor	7647-10-1	P433731	Palladium(II) chloride	reagent grade, extra pure, ≥99%	An activation precursor used to introduce catalytically active sites onto sensitized PEI surfaces and initiate subsequent electroless nickel deposition.
Electroless plating sensitizer	10025-69-1	T478535	Tin(II) chloride dihydrate	reagent grade, 98%	A sensitizer used for pretreatment of nonconductive surfaces such as PEI and used together with palladium chloride to establish the surface-activation sequence required for electroless plating.
Electroless plating reducing agent	10039-56-2	S475687	Sodium hypophosphite monohydrate	European Pharmacopoeia (Ph.Eur), puriss. p.a., ≥99%	A commonly used reducing agent for Ni-P electroless plating, used to drive nickel-phosphorus codeposition and suitable for constructing conductive surface layers and functional coatings on PEI.
Common lithium salt for liquid electrolytes	21324-40-3	L777368	Lithium Hexafluorophosphate	electronic grade, ≥99.99% trace metals basis	A commonly used lithium salt for liquid electrolytes, which can be used to evaluate the effects of PEI porous membranes or separators on electrolyte uptake, wettability, and electrochemical compatibility.
Lithium salt for polymer/high-temperature electrolytes	90076-65-6	B398978	Bis(trifluoromethane)sulfonimide lithium salt（LiTFSI）	≥99.9%	Commonly used in polymer electrolytes and higher-temperature electrochemical systems, and can be combined with PEI porous membranes, composite membranes, or gel systems to compare the effects of different lithium salts on ionic conductivity and thermal stability.

 

Note: The above are representative Aladdin products. For more product specifications, please search by “product name/CAS/catalog number” on the Aladdin official website.

 

References

 

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[2] Johnson RO, Burlhis HS. Polyetherimide: A new high-performance thermoplastic resin. Journal of Polymer Science: Polymer Symposia. 1983;70:129-143. doi:10.1002/polc.5070700111.

 

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[4] SABIC. SABIC opens multi-million-dollar ULTEM™ resin manufacturing facility in Singapore to meet growing demand in Asia-Pacific. 2024.

 

[5] SABIC. SABIC expands unique high-temperature film portfolio with launch of new 7 micron ULTEM™ dielectric film for high-voltage applications. 2018.

 

[6] SABIC. CONSISTENCY+ CAPABILITY: Specialized materials for the healthcare industry. 2018.

 

[7] SABIC. ULTEM™ HU1004 resin: A high performance resin blend for multiple sterilization environments. 2016.

 

[8] Stratasys. ULTEM™ 9085 resin material data sheet. 2025.

 

[9] McCrickard C, Ullah J, Boyd A, Archer E, Manzoor F. Polyether ether ketone (PEEK) and polyetherimide (PEI) for fused filament fabrication (FFF) in medical applications. The International Journal of Advanced Manufacturing Technology. 2025;140:5737-5754. doi:10.1007/s00170-025-16589-2.

 

[10] Xiao M, Wan B, Wang X, Zheng MS, Li Y, Zhang Y, et al. Improved high-temperature energy storage of polyetherimide by energy level structure regulation. Polymer. 2023;286:126397. doi:10.1016/j.polymer.2023.126397.

 

[11] Zhou Y, Zhang Z, Tang Q, Ma X, Hou X. Enhancing the high-temperature energy storage properties of PEI dielectrics by constructing trap-rich covalently cross-linked networks via POSS-functionalized BNNS. Materials Horizons. 2024;11:4348-4358. doi:10.1039/D4MH00299G.

 

[12] Hussain A, Islam MM, Shah SS, Zahir MH, Ahammad AJS, Aziz MA. Recent progress in polyetherimide membrane for high-performance lithium batteries. Journal of Energy Storage. 2025;131:117584. doi:10.1016/j.est.2025.117584.

 

[13] Iwasaki A, Kurioka T, Cheng PW, Chen CY, Chang TFM, Takase K, et al. Metallization of polyetherimide with 3D structures by supercritical carbon dioxide-assisted electroless Ni-P plating. Micro and Nano Engineering. 2024;24:100271. doi:10.1016/j.mne.2024.100271.

 

[14] Touré A, Rumeau JD, Thollet B, et al. Environmental impacts of three high-performance thermoplastics (HPTPs) and associated glass-fiber reinforced grades from different processing technologies. RSC Sustainability. 2026;4:972-986. doi:10.1039/D5SU00615E.

 

[15] Ma C, Kumagai S, Sato M, Nakai Y, Saito Y, Watanabe A, et al. Investigating the degradation and products of thermo-oxidation of polyimide-based engineering plastics. Journal of Analytical and Applied Pyrolysis. 2024;181:106575. doi:10.1016/j.jaap.2024.106575.

 

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Light-Emitting Polymers (LEPs): A Practical Panorama - A Core PL/EL Mechanistic Framework, Material Family Map, and Structural “Design Knobs” (including Product Tables 1–4 and a selection guide)

 

Understanding Hydrophilic Polymers in Aqueous Systems: Hydration Mechanisms, Structural Knobs, and Task-Oriented Selection Guide (Including Tables 1–3)

 

Biomedical Polymer Insights: Role-Based Task Map, Six Key Material Levers, and a Risk-Driven Evidence Chain (including the Product Navigation Guide and Product Tables 1–3)

 

Guide to Hydrophobic Polymers and Hydrophobic Surfaces: Wetting Models, Evaluation Metrics, and Task-Oriented Material Selection (including Tables 1–3)